Asus Prime H370M-Plus - Placa base 1151C

CPU

• LGA1151 socket for 8th Generation Intel® Core™ i7/ i5/ i3, Pentium® and Celeron® processors
• Supports 14nm CPU
• Supports Intel® Turbo Boost Technology 2.0*
• * The Intel® Turbo Boost Technology 2.0 support depends on the CPU types.

Chipset

• Intel® H370 Chipset

Memoria

• 4 x DIMM, maximum 64 GB, DDR4 2666/ 2400/ 2133MHz, non-ECC, unbuffered memory
• Dual channel memory architecture
• Supports Intel® Extreme Memory Profile (XMP)
• * The maximum memory frequency supported varies by processor.
• ** DDR4 2666MHz and higher memory modules will run at max. 2666MHz on Intel® 8th Gen. 6-core or higher processors.

Ranuras de expansión

• 1 x PCIe 3.0/2.0 x16 slot
• 1 x PCIe 3.0/2.0 x16 slot (max. at x4 mode)
• 2 x PCIe 3.0/2.0 x1 slots

Gráfica

• Integrated Graphics Processor- Intel® HD Graphics support
• Multi-VGA output support: HDMI/DVI-D/D-sub port
• - Supports HDMI 1.4b with max. resolution 4096 x 2160@24Hz / 2560 x 1600@60Hz
• - Supports DVI-D with max. resolution of 1920 x 1200 @60Hz
• - Supports D-sub with max. resolution 1920 x 1200@60Hz
• Supports Intel® InTru™ 3D/Quick Sync Video/Clear Video HD Technology/Insider™
• Supports up to 3 displays simultaneously
• Maximum shared memory of 1024 MB (for iGPU exclusively)

Compatibilidad Multi-GPU

• Supports AMD® 2-Way/Quad-GPU CrossFireX™ Technology

Almacenamiento

• Intel® H370 Chipset with RAID 0, 1, 5, 10 and Intel Rapid Storage Technology support
• - 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (SATA mode & X2 PCIE mode)*
• - 1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (X4 PCIE mode)
• - 6 x SATA 6.0 Gb/s ports (gray)
• - Ready for Intel® Optane Memory
• * When a device in SATA mode is installed on the M.2_1 socket, SATA_2 port cannot be used.

LAN

• Intel® I219-V Gigabit LAN- Dual interconnect between the integrated Media Access Controller (MAC) and physical layer (PHY)
• ASUS LANGuard

Audio

• Realtek® ALC887 8-channel* high definition audio CODEC
• - Audio Shielding: Ensures precision analog/digital separation and greatly reduces multi-lateral interference
• - Dedicated audio PCB layers: Separate layers for left and right channels to guard the quality of the sensitive audio signals
• - Premium Japanese audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity.
• - Supports jack-detection and front panel jack-retasking

USB

• Intel® H370 Chipset
• - 2 x USB 3.1 Gen 2 ports (up to 10Gbps) at back panel (Type-A)
• - 5 x USB 3.1 Gen 1 ports (up to 5Gbps) (2 ports @mid-board; 3 ports @back panel<2* TypeA, 1* TypeC™ )
• - 6 x USB 2.0 ports (4 ports @mid-board; 2 ports @back panel)

Conectores internos E/S

• 1 x USB 3.1 Gen 1 connectors support additional 2 USB ports (19-pin)
• 2 x USB 2.0 connectors support additional 4 USB ports
• 2 x M.2_1 Socket 3 (for M Key, type 2242/2260/2280 devices)
• 6 x SATA 6.0Gb/s connectors
• 1 x CPU Fan connector (support DC/PWM mode)
• 1 x AIO_Pump header (4-pin)
• 2 x Chassis Fan connectors (4-pin) for both 3-pin(DC mode) and 4-pin(PWM mode) coolers control
• 1 x Front panel audio connector (AAFP)
• 1 x 24-pin EATX Power connector
• 1 x 8-pin EATX 12V Power connector
• 1 x System Panel*
• 1 x COM port
• 1 x Mono Out header
• 1 x TPM header (14-1pin)
• 1 x Clear CMOS jumper

E/S panel trasero

• 1 x D-sub port
• 1 x HDMI port
• 1 x DVI-D port
• 1 x PS/2 combo port
• 1 x LAN (RJ45) port
• 2 x USB 3.1 Gen 2 ports (Type-A)
• 2 x USB 3.1 Gen 1 ports
• 1 x USB 3.1 Gen 1 TypeC™ port
• 2 x USB 2.0 ports
• 8-channel Audio I/O ports

Factor de forma

• mATX form factor (24.4 cm x 24.4cm)